Semiconductor Photonics and Electronics

Core modules:

MSc Investigative Research Project

The aim of this module is to provide a structured individual project to enable you to carry out practical and/or theoretical work that underpins your academic studies and allows for the acquisition and demonstration of a wide range of research skills.

60 credits

Semiconductor Materials

This module describes the basic physical properties (structural, optical, electrical) of semiconductor materials used in the electronic and opto-electronic industries, and in semiconductor based research. The aim is to equip you with a comprehensive background understanding of the physical, structural, optical, electronic properties of semiconductor materials used in modern electronic and opto-electronic devices. There is a laboratory assignment where characterisation of epitaxially-grown material will be performed.

15 credits

Principles of Semiconductor Device Technology

The unit describes the basic structure of materials and their relationship to the requirements of semiconductor devices for future applications, leading to methods of crystal growth, fabrication, modelling and characterization. The focus is on devices that underpin CMOS and its future evolution in AI: starting with the MOSFET, and leading on to future devices such as TunnelFET, Negative Capacitance FET and the Resistive Random Access Memory (RERAM).

15 credits

Energy Efficient Semiconductor Devices

The efficient use of energy is of critical importance to future growth and well-being, providing a mechanism to reduce global emissions and to offset the impact of increasing fuel costs. Semiconductor devices can play can crucial role in this key global challenge, providing options which can both improve energy efficiency and also means for renewable energy generation. The course describes four key sectors where semiconductor devices are making considerable impact on energy efficiency.

15 credits

Compound Semiconductor Device Manufacture

The module will cover the theory and practice of the growth of compound semiconductor epitaxial layers, the characterisation of those layers and the design, fabrication and characterization of compound semiconductor devices such as LEDs, laser diodes, and transistors. You will gain practical experience in all aspects of the creation of a compound semiconductor device including the safety issues associated with device manufacture. You will also obtain a broad understanding of the global importance of compound semiconductor technology manufacturing.

30 credits

Engineering Research and Design Project

The aim of this module is to equip students with skills, knowledge and experience needed to carry out research independently and as a team for solving engineering problems set in a range of globally applicable contexts.  As members of a team, students will develop and demonstrate a range of skills that will enhance their ability to tackle research projects and add value to their employability.  Specifically, students will develop skills in the areas of critical literature review, engineering design, project management, team working, and communication.

15 credits

Optional modules - two from:

Power Semiconductor Devices

This module will look at power semiconductor devices: physics, technology, characteristics, packaging and application.

15 credits

Advanced Integrated Electronics

This module will advance your understanding of analogue and digital VLSI design. It concentrates on issues such as power consumption, the effect of interconnect, non-CMOS logic, circuit layout, analog amplifiers, data converters, and using Spice.

15 credits

Nanoscale Electronic Devices

The course aims to provide students with an understanding of the science and technology which underpins modern electronic device technology, with an emphasis on integrated electronic devices at the nanoscale.

15 credits

Optical Communication Devices and Systems

The course examines the behaviour of the components in a communications system and the way in which their design and individual performance is determined by that of the system requirements.

15 credits

Packaging and Reliability of Microsystems

The module describes the methods used to fabricate microsystems. It also introduces and develops an understanding of the reliability and failure mechanisms in the devices and resulting microsystems.

15 credits